TEM Study of the Interface Between HIPed Silicon Nitride and Encapsulation Borosilicate Glass

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TEM Study of the Interface Between HIPed Silicon Nitride and Encapsulation Borosilicate Glass

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Publication Article, peer reviewed scientific
Title TEM Study of the Interface Between HIPed Silicon Nitride and Encapsulation Borosilicate Glass
Author(s) Wei, Liu-Ying ; Westman, A-K
Date 2000
Host/Issue Journal of Materials Science
ISSN 1573-4803
Pages 2847-2854
Language swe (iso)
Subject(s) Technology
Technology
Handle http://hdl.handle.net/2043/4814 (link to this page)

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